Summary We are looking for a highly skilled SMT professional with strong electronics background to coordinate and manage programs related to AOI, SPI, Pick & Place (P&P), Reflow/Profile, X-ray inspection, and End-of-Line (EOL) rework activities. The role requires deep expertise in SMT processes, machine programming, defect analysis, and cross-functional coordination to ensure high-quality production output. Key Responsibilities Program Coordination Coordinate complete SMT program setup and validation including: AOI (Automated Optical Inspection) SPI (Solder Paste Inspection) Pick & Place machines Reflow oven profiling X-ray inspection programs Ensure smooth program releases from NPI to mass production. Maintain version control and optimization of machine programs. Process Engineering & Optimization Develop, validate, and optimize SMT process parameters. Perform solder paste, stencil, and component placement optimization. Define and monitor reflow profiles for different PCB assemblies. Troubleshoot process issues and improve first-pass yield (FPY). Inspection & Quality Control Create and fine-tune AOI & SPI inspection criteria and libraries. Develop X-ray inspection standards for BGA/QFN and critical components. Analyze defects such as: Solder bridges Insufficient/excess solder Component misalignment Voids and hidden defects EOL Rework Coordination Coordinate End-of-Line (EOL) rework activities. Analyze failure modes and root causes. Guide rework technicians for complex repairs (BGA, fine-pitch, etc.). Ensure rework quality meets IPC standards. NPI & Documentation Support New Product Introduction (NPI) builds. Prepare and maintain: Work instructions (WI) SOPs Process flow documents Conduct risk assessments and DFx (Design for Manufacturability). Cross-functional Coordination Liaise with production, quality, maintenance, and design teams. Support customer requirements and audits. Ensure compliance with IPC, ISO, and customer quality standards. Required Skills & Competencies Strong knowledge of SMT processes and electronics assembly. Hands-on experience with: AOI, SPI, P&P programming Reflow profiling tools X-ray inspection systems Expertise in defect analysis and root cause methodologies (8D, Fishbone, etc.). Good understanding of PCB design and electronic components. Familiarity with IPC standards (IPC-A-610, IPC-7711/7721). Strong analytical and problem-solving skills. Educational Qualification Bachelor’s / Diploma in: Electronics Engineering Electrical Engineering Instrumentation or related field Experience Minimum 5–10 years of experience in SMT/EMS industry. Proven experience in program coordination and process engineering. Preferred Skills Experience in high-mix, high-volume production environments. Knowledge of MES systems and Industry 4.0 tools. Six Sigma / Lean Manufacturing exposure is an advantage. Key Performance Indicators (KPIs) First Pass Yield (FPY) Defect per Million Opportunities (DPMO) Reduction in rework/rejection rates Program stability and downtime reduction Requirements